[Download] "Handbook of Wafer Bonding" by Peter Ramm, James Jian-Qiang Lu & Maaike M. V. Taklo * Book PDF Kindle ePub Free
eBook details
- Title: Handbook of Wafer Bonding
- Author : Peter Ramm, James Jian-Qiang Lu & Maaike M. V. Taklo
- Release Date : January 17, 2011
- Genre: Engineering,Books,Professional & Technical,
- Pages : * pages
- Size : 14439 KB
Description
The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary bonding and micro-electro-mechanical systems (MEMS) with new functional layers. Written by authors and edited by a team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies.
Part I sorts the wafer bonding technologies into four categories: Adhesive and Anodic Bonding; Direct Wafer Bonding; Metal Bonding; and Hybrid Metal/Dielectric Bonding. Part II summarizes the key wafer bonding applications developed recently, that is, 3D integration, MEMS, and temporary bonding, to give readers a taste of the significant applications of wafer bonding technologies.
This book is aimed at materials scientists, semiconductor physicists, the semiconductor industry, IT engineers, electrical engineers, and libraries.
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